Vacuum Oven 200-VO105

Lab Expo Vacuum Oven 200-VO105 provides precise temperature control from RT +10 to 200 ℃ with ±1 ℃ stability and a stainless steel chamber measuring 300×300×275 mm. It achieves vacuum levels down to 133 Pa, features microprocessor control with timing function, dual-layer tempered glass door, and operates on 220 V, 50 Hz at 40 W power consumption. Suitable for drying thermo-sensitive materials in quality control, research, pharmaceutical and industrial laboratories requiring inert gas compatibility and uniform heating.

$3,552.00 $ 2960

Vacuum Oven 200-VO105 - Specifications

Number of Shelves 1
Display Resolution 0.1 ℃
Temperature Range RT + 10 to 200 ℃
Temperature Stability ± 1 ℃
Ambient Temperature 5 to 40 ℃
Vacuum Degree 133 Pa
Chamber Material Stainless steel
Interior Dimension (W × D × H) 300 × 300 × 275 mm
Exterior Dimension(W × D × H) 605 × 490 × 450 mm
Power Consumption 400 W
Power 220 V,50 Hz

Vacuum Oven 200-VO105 - Key Features

  • Microprocessor controller with timing function and 0.1C resolution
  • Temperature range RT+10 to 200C with ±1C stability across operating range
  • Vacuum degree of 133 Pa achieved through integrated pump and valve system
  • Power consumption rated at 4W under standard operating conditions

Vacuum Oven 200-VO105 - Applications

FunctionImplementation
Quality control drying±1 ℃ temperature stability ensures consistent sample processing
Pharmaceutical material testing300×300×275 mm chamber accommodates standard batch sizes
Industrial inert processing133 Pa vacuum degree enables oxygen-sensitive material handling
Research sample preparationRT +10 to 200 ℃ range supports diverse thermal applications
Laboratory throughput operations40 W power consumption allows continuous low-energy use

Vacuum Oven 200-VO105 - Catalog

Related Vacuum Oven

Lab Expo Vacuum Ovens are designed around sealed low-pressure chamber systems to enable controlled thermal processing of heat-sensitive materials. This industrial vacuum oven maintains stable temperature under reduced pressure to limit oxidation and thermal stress. Microprocessor regulation, stainless steel interiors, vacuum integrity monitoring, and over-temperature protection support consistent drying, degassing, and conditioning workflows in laboratory and industrial environments.